Vitrified Bond Ultra-Thin Diamond Wheel for Silicon Wafer & Sapphire

Ultra-Thin Vitrified Diamond Wheel, Low Damage for Semiconductor Wafer Back Grinding

Product Overview

Ultra-thin vitrified diamond wheel for semiconductor wafer thinning. Extremely tight runout and flatness ensure minimal subsurface damage. Fine grit and uniform bonding deliver ultra-smooth surfaces.

Key Specifications

Parameter

Details

Available Wheel Shapes

1A1 / 9A1 (Ultra-thin, ≤5mm)

Bond Type

Vitrified (Ceramic, Fine Porosity)

Abrasive

Synthetic Diamond (SDC, Fine Grade)

Standard Sizes (D×T×H)

200×3×76.2, 250×4×76.2, 300×5×100

Grit Range

#800 – #3000

Concentration

50% / 75%

Max Speed

35 m/s

Precision

Runout ≤0.008mm, Flatness ≤0.005mm

Workpiece

Silicon Wafer, Sapphire, SiC, GaN

Applications

Ceramic Substrate, Glass Lens, Sapphire Surface Grinding

Customization

Semiconductor Wafer Back Grinding, Thinning

Lead Time

12–20 days

Features & Advantages

✅ Ultra-Thin & Rigid: Thin body with high stiffness for wafer thinning.

✅ Low Damage: Subsurface damage <5μm, high wafer yield.

✅ High Flatness: TIR ≤0.008mm, consistent wafer thickness.

✅ Fine Finish: Ra ≤0.02μm for post-grinding polishing.

✅ Heat Resistant: Vitrified bond stable at high grinding temperatures.

Applications & Workpiece Materials

  • Silicon wafer (200mm/300mm) back grinding & thinning

  • Sapphire substrate for LED, mobile camera lenses

  • SiC/GaN power semiconductor wafers

  • Optical components, precision glass sheets

  • High-precision wafer grinders, CNC ultra-precision grinders

If you need a custom solution for special materials or applications, please use the form below to tell us your requirements.

200mm / 250mm / 300mm / Custom

#800 / #1200 / #2000 / #3000

76.2mm / 100mm / Custom

Request a Custom Diamond Wheel Quote

Tell us your grinding requirements below, and our engineering team will send you a tailored quotation within 24 hours.