Metal Bond Diamond Wheels for High-Stock-Removal Applications
Sintered bronze and steel matrix wheels engineered for glass, silicon, and stone. Diamond retention measurably superior to resin in abrasive environments — longer tool life, consistent cut rate.
Metal Bond Wheel Configurations
MB-F Flat Grinding Wheels
MB-D Dicing Blades
MB-C Cup Wheels
MB-P Profile Wheels
Steel matrix thin-kerf blades for semiconductor wafer dicing and ceramic slicing. Kerf widths from 0.1 mm with controlled chipping tolerance.
Heavy-duty bronze cup wheels for stone, glass block, and hard ceramics. Segmented design enables coolant flow and reduces heat buildup at high feed rates.
Custom-profile sintered wheels for edge forming, lens beveling, and contour grinding. Profiles held to ±0.01 mm from supplied DXF geometry.
Bronze matrix flat wheels for surface grinding optical glass and silicon wafers. Consistent flatness within 2 µm across full face width.
Comparative Wear Data
Bond, Grain, and Application Fit
In ISO-controlled abrasion tests on fused silica, metal bond wheels delivered 3.2× the dressed wheel life of equivalent resin bond at identical MRR.
Spec sheets with material-specific wear curves available on request. Include workpiece material, surface finish target, and current wheel specification.
Metal bond holds diamond abrasive in a rigid sintered matrix — optimal for hard, abrasive workpieces where resin bond would wear prematurely. Select by matrix and grit for your material.
Bronze matrix: optical glass, fused silica, sapphire. Steel matrix: silicon wafers, advanced ceramics, hard stone. Grit range D15–D151 available across all configurations.
Specify Your Metal Bond Wheel
Send your workpiece material, target MRR, and tolerance requirements. We return a binder-specific recommendation with lead time and comparative wear data within 48 hours.