Ultra-Thin Electroplated Diamond Cutting Wheel for Glass, Quartz & Sapphire

Product Overview

This ultra-thin electroplated cutting wheel adopts single-layer fine diamond electroplating technology. With an ultra-narrow rim, it realizes minimal material loss during cutting. The uniformly distributed diamond grains deliver stable cutting performance, effectively prevent chipping and cracks on brittle workpieces. It is a ideal choice for high-precision processing of optical materials and semiconductor wafers.

Key Specifications

Features & Advantages

✅ Ultra-thin rim design, narrow cutting kerf and low material waste

✅ Fine diamond grit, creates smooth cut surface without chipping or cracks

✅ High concentricity, runs stably under high working speed

✅ Low heat generation, avoids thermal damage to workpieces

✅ Firm electroplated layer, anti-shedding and long service life

✅ No dressing required, easy operation and high efficiency

Applications & Workpiece Materials

• Optical glass, borosilicate glass and watch glass

• Quartz crystal, quartz components and quartz wafers

• Sapphire substrates, LED sapphire chips

• Alumina ceramics, zirconia ceramic thin pieces

• High-precision cutting machines, wafer dicing equipment, CNC slotting machines

If you need a custom solution for special materials or applications, please use the form below to tell us your requirements.